用于高密度光子封装的晶圆级可插拔光学 I/O 平台

该项目旨在开发一种与铸造工艺兼容的光学 I/O 平台，以构建低损耗、高密度的可插拔光学接口，并融合光学模式工程与被动对准技术。研究将涉及宽带边缘耦合器及连接器架构的设计与测试，从而提升耦合效率与性能一致性。

About the project Reliable optical connections are essential to scaling photonic systems. This project will develop a foundry-compatible platform for low-loss, high-density, pluggable optical interfaces. It will combine broadband edge couplers, passive alignment and wafer-level testing to establish repeatable connections for optical interconnects and photonic packaging. Optical packaging is a critical barrier to scaling integrated photonics. High-density interfaces must provide low coupling loss while accommodating fabrication and assembly tolerances. For pluggable connections, these requirements must also be maintained through repeated attachment and detachment. This project aims to establish a foundry-compatible optical I/O platform that integrates device design, connector architecture and packaging. The central research question is how optical mode engineering and passive alignment can deliver repeatable, low-loss connections (<1dB per fibre) at high interface density. The research will develop broadband edge couplers with expanded optical modes and evaluate the trade-offs between coupling efficiency, bandwidth, footprint and alignment tolerance. These designs will be integrated with fibre arrays and expanded-beam interfaces to investigate detachable connector architectures. Optical simulation, fabrication and experimental characterisation will establish the effects of process variation, assembly errors and repeated mating on performance. Wafer-level optical testing will be investigated alongside packaging methods to support reproducible device screening and assembly. A prototype interface will validate coupling loss, operating bandwidth, alignment tolerance and connection repeatability. The expected contribution is a set of experimentally validated interface designs and testing methods that provide a route towards scalable photonic packaging. The platform will address optical connectivity requirements in pluggable modules, near-packaged optics and co-packaged optics with collaborating with ORC fiber group. Comprehensive training will be provided in photonic and optical modelling using Ansys Lumerical, COMSOL Multiphysics and Zemax, alongside full equipment training in the University of Southampton’s cleanroom facilities. You'll also receive hands-on training in optical measurements and silicon photonic chip testing, including optical alignment, fibre-to-chip coupling and device characterisation. Together, these activities will develop the skills required to design, fabricate and experimentally validate integrated photonic devices. The School of Optoelectronics (ORC) is committed to promoting equality, diversity inclusivity as demonstrated by our Athena SWAN award. We welcome all applicants regardless of their gender, ethnicity, disability, sexual orientation or age, and will give full consideration to applicants seeking flexible working patterns and those who have taken a career break. The University has a generous maternity policy, onsite childcare facilities, and offers a range of benefits to help ensure employees’ well-being and work-life balance. The University of Southampton is committed to sustainability and has been awarded the Platinum EcoAward.

入学要求 英国南安普顿大学2:1荣誉学位课程，或同等国际认可度的物理学或相关学科学位。

资助：完全由资金支持（仅英国境内） 学费与资助 我们为英国本土学生和国际学生提供多种资助机会。符合条件的学生可通过“地平线欧洲”学费减免，自动免除国际学生学费与英国本土学生学费之间的差额。 大学通过竞争性遴选授予的校长助学金，为遴选排名靠前的申请人支付国际学生学费与英国本土学生学费之间的差额。 本校各学院通过竞争性遴选提供的博士奖助金，通常为遴选排名靠前的申请人支付按英国本土学生标准收取的学费，并提供生活津贴。 资助采用滚动授予方式，因此请尽早申请，以尽可能增加进入资助评选的机会。 如需了解更多信息，请访问我们的研究生研究资助页面。

如何申请 您需： 选择课程类型（研究型）、2027/28学年、工程与物理科学学院 选择全日制或非全日制 搜索博士项目 PhD ORC（7097） 在申请表第2部分填写导师姓名 申请材料应包括： 您的CV（个人简历） 2份学术推荐信 截至目前的学位课程成绩单和证书 英语语言资格证明（如适用）